| GF180MCU Process |
| ~20mm2 silicon |
| 3.88mm x 5.07mm die size |
| 1,000 die wire bonded onto PCBs |
| GF180MCU Process |
| ~20mm2 silicon |
| 3.88mm x 5.07mm die size |
| 1,000 raw dies |
| Undiced 200mm wafer. |
| Only valid with slot purchase. |
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| Milestone | Date | Description |
|---|---|---|
| Purchase Deadline | 28 November 2025 | Final deadline to purchase manufacturing slots |
| Design Submission | 3 December 2025 | Final deadline to submit GDS files for fabrication |
| Tape-out to GlobalFoundries | 5 December 2025 | GDS files delivered to GlobalFoundries for fabrication |
| Fabrication Complete | February 2026 | Wafers returned from GlobalFoundries fabrication |
| Delivery to Customers | 15 March 2026 | Finished dies shipped to customers worldwide |
19.67 mm²
3.88mm × 5.07mm
5 Layers
Full routing capability
1,000 dies
Per manufacturing slot
MIM & PIP
Metal-insulator-metal available
Poly & High-Res
Multiple resistor types
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