Budget silicon manufacturing.
Shuttle Status
Where each wafer.space shuttle is on its journey from final orders to silicon in your hands
GF180MCU Run 1
In Flight- Completed: Final Order Date 28 November 2025
- Completed: GDS In Date 3 December 2025
- Completed: GF Mask Manufacturing January – February 2026
- Completed: GF Wafer Manufacturing March – May 2026
- Completed: Dicing & Sorting Late May 2026
- Completed: Bare Dies Shipped Early June 2026
- Completed: Chip on Board Packaging June 2026
- In progress: Chip on Board Packaged Shipped Rolling out from June 2026
GF180MCU Run 2
In Flight- Completed: Early Bird Deadline 30 April 2026
- Completed: Final Order Date 30 June 2026
- Completed: GDS In Date 14 July 2026
- Completed: GF Mask Manufacturing Late July 2026
- In progress: GF Wafer Manufacturing Est. August – October 2026
- Dicing & Sorting Est. October 2026
- Bare Dies Shipped Est. 16 October 2026
- Chip on Board Packaging Est. November 2026
- Chip on Board Packaged Shipped Est. November 2026
GF180MCU Run 3
Boarding- Boarding — orders open
- Early Bird Deadline 30 September 2026
- Final Order Date 9 December 2026
- GDS In Date 16 December 2026
- GF Mask Manufacturing Est. January 2027
- GF Wafer Manufacturing Est. January – April 2027
- Dicing & Sorting Est. April 2027
- Bare Dies Shipped Est. 16 April 2027
- Chip on Board Packaging Est. May 2027
- Chip on Board Packaged Shipped Est. May 2027