We’re announcing a collaboration between wafer.space and Tiny Tapeout, creating a pathway from educational silicon projects to low-volume production. This partnership was highlighted by Matt Venn at the FSiC 2025 conference.
Start with Tiny Tapeout: Get your first design manufactured on silicon for just $50-300. Tiny Tapeout provides an educational platform where you can learn the fundamentals of chip design without the complexity of a full chip project.
Transition to wafer.space: When you’re ready for low-volume production, wafer.space offers the next step. Apply your Tiny Tapeout experience to create a dedicated chip design starting at $7,000 for bare dies or $8,500 for wire-bonded chips.
The collaboration addresses a gap in the silicon ecosystem - the jump from educational projects to low-volume chip manufacturing. With Tiny Tapeout and wafer.space, there’s now a clearer progression:
Both platforms will offer GF180MCU process technology as an option. Tiny Tapeout is adding GF180MCU support to complement their existing SKY130 and iHP130 processes, providing a cost-effective alternative. Knowledge gained about timing, power, and area constraints in Tiny Tapeout’s GF180MCU runs can be applied to wafer.space projects.
This partnership creates an educational-to-production pipeline:
Ready to begin your silicon journey? Here’s how:
From $50 educational projects to $7,000 low-volume production chips, we’re working to make silicon manufacturing more accessible.
Ready to start your silicon journey? Join Tiny Tapeout or learn more about wafer.space today.